實(shí)用的英文學(xué)術(shù)會(huì)議邀請(qǐng)函3篇
簡潔明了是邀請(qǐng)函的特點(diǎn)之一。在學(xué)習(xí)、工作生活中，用到邀請(qǐng)函的地方很多，那么寫邀請(qǐng)函真的很難嗎？下面是小編精心整理的`英文學(xué)術(shù)會(huì)議邀請(qǐng)函3篇，希望對(duì)大家有所幫助。
英文學(xué)術(shù)會(huì)議邀請(qǐng)函 篇1
Dear Colleagues,
It is a great pleasure to invite you to the XXth International Conference on Composite Materials (ICCMXX), which will be held from July 28 to August 2, 20xx in Montreal, Canada. This conference is one of the most highly acclaimed meetings in the field of composite materials and it takes place biannually in different countries all over the world. Most recently, the conference was held in Edinburgh, UK (20xx) and Jeju, Korea (20xx). We are truly glad to host such a prestigious event in the beautiful city of Montreal.
This time, the organizing committee has chosen "Composite Materials: The Great Advance" as the main theme for the conference, with a focus on the latest developments and trends, as well as future outlook of the field of composite materials and structures. The conference program includes plenary lectures, oral and poster presentations, exhibitions, and various social programs for over 1,000 participants from around the world.
Abstract submissions have now begun. On behalf of ICCMXX, we extend an invitation to you to submit an abstract(s) for oral and/or poster presentations. The deadline for submissions is December 15, 20xx. Abstracts are submitted online in Confsys (our online submission management system). Authors must complete the sign in process (including profile and interests) before being able to submit. You will find full instructions and abstract template at http://iccmXX.org/abstract_submit.htm.
Abstracts will be peer-reviewed by the scientific program committee from December 27, 20xx to February 22, 20xx. Notification of Acceptance will be provided by email to the Author(s) by February 28, 20xx. A presenter for each accepted abstract must then register with full payment and accept copyright clearance before the full paper upload will be accepted.
We thank you for your consideration and look forward to hearing from you. Should you have any questions, please contact ICCMXX Secretariat at iccm@iccmXX.org.Sincerely,
Suong V. Hoa, General Chair
Pascal Hubert, Technical Program Chair
ICCMXX Secretariat 1455 De Maisonneuve West, Ev4-145 Montreal, Quebec, Canada H3G 1M8 Tel: 514-848-2424 x7997 Fax: 514-848-45XX
February 9, 20xx
英文學(xué)術(shù)會(huì)議邀請(qǐng)函 篇2
Dear professor wang,
on behalf of the ohio state university and the ieee computer society, i would be very pleased to invite you to attend and chair a session of the forthcoming XX international conference on parallel data processing to be held in bellaire, michigan, from october 25 to october 28, XX.
you are an internationally acclaimed scholar and educator. your participation will be among the highlights of the conference. we sincerely hope that you could accept our invitation. as you know, this is the 0th anniversary of the conference and we plan to make it a truly international meeting. we have accepted many papers from several foreign countries, including two from china. if you can come, please let us know as soon as possible, since we have to prepare the final program soon. we are looking forward to your acceptance. sincerely yours, peter white
英文學(xué)術(shù)會(huì)議邀請(qǐng)函 篇3
Dear Ms Wang:
I have the great pleasure, on behalf of the International Conference on Medical Biometrics organization, of inviting you to contribute to the symposium on Medical device technologies, Medical data processing and management, Medical Pattern Recognition, Medical biometric systems and applications to be held in Shenzhen, between 30th May and 1th June 20xx.
We would like to invite you to submit a manuscript to the International Conference on Medical imaging devices, Medical information retrieval, Biometric technologies, Feature matching and classification, Computer-aided diagnosis and Other applications. The idea is to present originally contributed research, review, and short communication articles in the field of Medical Biometrics. Deadline for submissions would be April 3, 20xx. Kindly submit your manuscripts as an E-mail attachment at luguangm@hit.edu.cn.寫作模板
I will be looking forward to your favorable reply.
Sincerely yours,
Guangming Lu
20xx-01-02
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